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Semiconductor Packaging Materials

Semiconductor Packaging Materials

advanced, AlSiC, ASPI, bonding materials, carrier, Cladding, clean, copper tungsten, CuMo, CuW, EDM Products, fine wire, flange, flip chip, heat dissipation, heat elimination's, Known good Die, metal stampings, MoCu, Polese Company, Polese, polishing, powdered metal, reclaim, reclamation, ribbon, seal frames, Semiconductor Packaging Materials, SPM, foundation components, silicon strip and clean, silicon wafer polishing,silicon wafer reclamation, silicon, Silvar, SilvarK, specialty materials, SPM, strip & clean, strip and clean, strip, tape on reel, thermal management, tungsten copper, wafer wafer reclaim, wafer reclamation, wafer, wafers, WCu, bonding materials, bump wire, heat sink, metal preforms, packaging components, power to plating, gold wire, fine gold wire, aluminum wire, SPM Corporation, Gil Raker, fine wire drawing, 300 mm wafer, Sealing Frames, EDM, wire spooling, KOVAR, aluminum silicon wire, bond pads, die attach preforms, aluminum silicon carbide, gold bump wire, leadframe stampings, gold-tin, solder alloys, contract taping, gold tin, solder, solder wire, gold germanium, gold silicon, Eutectic, Braze, solder brazing, silver copper, LDMOS, Bi-polar, Transmit, Receive, T/R module, radio, amplifier, housing, package, MMC, LTCC, HTCC, point-to-point, point-to-multipoint, RF, millimeter wave, microwave, DSP, metal-matrix composite, thermkon, elkonite,spreader heat spreader, lead-free, laser mount, C-mount, A-mount, A-block, modules, lids, caps, covers, fiber optics, laser diodes, MMIC, GaAs, gallium arsenide, hermetic, hermeticity
http://www.sempck.com

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Phone: 914-273-5500
Fax: 914-273-2065
1 Labriola Ct.
Armonk, NY 10504

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Semiconductor Packaging Materials

advanced, alsic, aspi, bonding materials, carrier, cladding, clean, copper tungsten, cumo, cuw, edm products, fine wire, flange, flip chip, heat dissipation, heat elimination's, known good die, metal stampings, mocu, pol...

http://www.sempck.com